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Electromagnetic Analysis and
Modeling Techniques for High-Frequency
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The IC design scenario presents new challenges as frequencies keep increasing
toward the tens of GHz range. "Systems on a Chip" (SoC) and "Systems on Package"
(SoP) are expected to become pervasive in the same way as "Systems on PCB"
were in the past. Due to the high frequencies, SoC and SoP will experience
electromagnetic issues similar to those observed on PCB, such as inductance
coupling, power grid resonances, and electromagnetic interference. Unfortunately
most PCB common solutions, such as building and testing prototypes, are typically
not available at IC level. In addition, new issues are introduced in SoC
by the integration of emerging technologies such as Micro-Electro-Mechanical
(MEM) and opto-electronic components. Integration of effective electromagnetic
capabilities into standard circuit simulators and IC design methodologies
has become a crucial requirement. Furthermore, providing design support in
terms of combined thermal / mechanical / electromagnetic / electrical simulation
and modeling capabilities is soon to become critical as well.
In this talk I will address some of the most relevant analysis and modeling
needs for the future of IC design from the joint electromagnetic/circuit
point of view. In particular I will describe a technique that allows the
electromagnetic simulation of circuit interconnect in time and memory 400
times smaller than other available classical methods. Exploiting this method,
accurate electromagnetic simulation of for instance the entire global power
distribution grid of a chip or package has now become possible. In the second
part of the talk I will then illustrate techniques for modeling of high frequency
interconnect structures which accurately capture and cast all their electromagnetic
effects into low order models. Such models can potentially be used in higher
level simulation tools, or can be exploited during interconnect synthesis
and optimization.
Luca Daniel is a PhD candidate in Electrical Engineering at UC Berkeley
in the group of prof. Sangiovanni-Vincentelli. He has also been recently
collaborating with prof. Jacob White at MIT. Luca's research experience includes
electromagnetic interference, signal
integrity, numerical analysis, mixed-signal and RF circuit design, MEMs design
and fabrication and power electronics. Luca has worked for Cadence Berkeley
Labs, for HP Research Labs in Palo Alto, he has collaborated with STMicroelectronics
Berkeley Labs, and he will join the Massachusetts Institute of Technology
as an Assistant Professor starting January 2003.
Luca received the "IEEE Prize Paper Award" for the best paper published on
IEEE Trans. on Power Electronics in the year 1999. He has also received four
best paper awards in conferences, the SRC international Graduate Fellowship
and the 2001 Bernard Friedman Memorial Prize in Applied Mathematics, from
the Dept. of Mathematics at UC Berkeley, for "demonstrated research ability
in applied mathematics."